High concentration low dielectric constant filler dispersion.
We offer a "high-concentration low-dielectric constant filler dispersion" that is highly dispersed with spherical silica and spherical boron nitride nanoparticles.
Spherical silica is often used as a filler to protect electronic materials, particularly semiconductors, and by using special spherical silica, we are able to implement "low dielectric constant." Additionally, boron nitride is well-known for its excellent thermal conductivity, but it also possesses excellent insulation and low dielectric constant. Since hexagonal boron nitride is in the form of spherical nanoparticles rather than flakes, it is expected to provide heat dissipation without the need for controlling anisotropy, in addition to having a low dielectric constant. Customization is available according to your needs (such as improving compatibility with target materials or changing solvents).
- Company：トクシキ
- Price：Other
